JPH01176932U - - Google Patents
Info
- Publication number
- JPH01176932U JPH01176932U JP7431288U JP7431288U JPH01176932U JP H01176932 U JPH01176932 U JP H01176932U JP 7431288 U JP7431288 U JP 7431288U JP 7431288 U JP7431288 U JP 7431288U JP H01176932 U JPH01176932 U JP H01176932U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bump
- region
- thermocompression
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7431288U JPH01176932U (en]) | 1988-06-06 | 1988-06-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7431288U JPH01176932U (en]) | 1988-06-06 | 1988-06-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01176932U true JPH01176932U (en]) | 1989-12-18 |
Family
ID=31299428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7431288U Pending JPH01176932U (en]) | 1988-06-06 | 1988-06-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01176932U (en]) |
-
1988
- 1988-06-06 JP JP7431288U patent/JPH01176932U/ja active Pending